The highest accuracy can reach ± 1 micrometer, using a fully closed-loop operation control system to achieve high-precision, high-efficiency, and robust positioning motion
The minimum IndexTime can reach 240 milliseconds, with a large base and high rigidity structure, achieving high load, low vibration, and fast tuning motion
The maximum lifting force is 750kgf, and the Z-axis four bar integrated support achieves the minimum deformation under high load or unbalanced load conditions
Testing temperature range -40 ° C to 200 ° C, independently developing various CHUCKs to solve core process problems and achieve precise temperature control
FUNCTION
Wafer Alignment Function
Wafer ID OCR function
Compatible with up to 2 million dies
Adjustment and retesting, compatible with mainstream foreign models in both directions
Quickly generate a map from guided files
Repeat Touch function
Needle Alignment Function
PMI needle mark detection function
GPIB communication
Holding SECS/GEM communication protocol
Offline editing of Map and Die attributes
Fully compatible with the Map file format of mainstream foreign models
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◆规格参数：
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C300
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H300
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T300
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M300
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适用场合
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通用机型
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通用机型
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适用于三温
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适用于存储
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适用晶圆尺寸
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12寸/8寸
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适用晶圆厚度*
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200~2200μm
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200~2200μm
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200~2200μm
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200~2200μm
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综合精度
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XY轴：±1μm
ZF轴：±2μm
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XY轴：±1μm
ZF轴：±2μm
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XY轴：±1μm
ZF轴：±2μm
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XY轴：±1μm
ZF轴：±2μm
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Index time
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240ms
(X/Y:10mm,Z:0.5mm)
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240ms
(X/Y:10mm,Z:0.5mm)
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240ms
(X/Y:10mm,Z:0.5mm)
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240ms
(X/Y:10mm,Z:0.5mm)
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针测压力
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250kgf
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250kgf
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250kgf
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750kgf
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测试温度*
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常温
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常温~150℃
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-55~200℃
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常温~150℃
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测试机对接方式*
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Cable,Hard Docking,Direct
Docking
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Cable,Hard Docking,Direct
Docking
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Cable,Hard Docking,Direct
Docking
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Hinge,Auto-leveling
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通讯接口
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GPIB,RS232
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GPIB,RS232
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GPIB,RS232
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GPIB,RS232
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设备尺寸
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1680mm(W)*1890mm(D)*14
90mm(H)
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1680mm(W)*1890mm(D)*14
90mm(H)
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1680mm(W)*2080mm(D)*14
90mm(H)
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2000mm(W)*1890mm(D)*14
90mm(H)
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设备重量
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2000kg
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2000kg
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2000kg
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2200kg
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电力要求
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220VAC1.0KVA
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220VAC 2.0KVA
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220VAC5.7KVA
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220VAC 2.0KVA
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压缩空气气压
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≥0.6MPa
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≥0.6MPa
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≥0.6MPa
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≥0.6MPa
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真空气压
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≤-60kPa
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≤-60kPa
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≤-60kPa
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≤-60kPa
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※支持伯努利手指，满足薄片要求 ※支持温度定制-60℃ ※支持自动换卡 (APC) ※支持加装FFU, 满足高洁净度要求
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C200
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H200
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T200
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T200HV
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适用场合
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通用机型
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通用机型
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适用于三温
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适用于三代半
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适用晶圆尺寸
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8寸/6寸/5寸/4寸
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适用晶圆厚度*
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200~2200μm
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200~2200μm
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200~2200μm
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200~2200μm
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综合精度
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XY轴：±2μm
ZF轴：±2μm
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XY轴：±2μm
ZF轴：±2μm
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XY轴：±2μm
ZF轴：±2μm
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XY轴：±2μm
ZF轴：±2μm
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Index time
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250ms
(X/Y:10mm,Z:0.5mm)
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250ms
(X/Y:10mm,Z:0.5mm)
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250ms
(X/Y:10mm,Z:0.5mm)
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250ms
(X/Y:10mm,Z:0.5mm)
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针测压力
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150kgf
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150kgf
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150kgf
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150kgf
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测试温度*
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常温
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常温~150℃
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-55~150℃
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-40~150℃
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测试机对接方式
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Cable,Hard Docking
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Cable,Hard Docking
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Cable,Hard Docking
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Cable,Hard Docking
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通讯接口
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GPIB,RS232
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GPIB,RS232
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GPIB,RS232
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GPIB,RS232
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设备尺寸
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1300mm(W)*1542mm(D)*96
0mm(H)
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1300mm(W)*1542mm(D)*96
0mm(H)
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1300mm(W)*1740mm(D)*96
0mm(H)
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1300mm(W)*1740mm(D)*96
0mm(H)
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设备重量
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1200kg
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1200kg
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1200kg
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1200kg
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电力要求
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220VAC1.0KVA
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220VAC 2.0KVA
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220VAC5.7KVA
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220VAC5.7KVA
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压缩空气气压
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≥0.6Mpa
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≥0.6Mpa
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≥0.6Mpa
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≥0.6Mpa
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真空气压
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≤-60kPa
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≤-60kPa
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≤-60kPa
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≤-60kPa
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※支持伯努利手指，满足薄片要求 ※支持温度定制-60℃ ※支持加装FFU, 满足高洁净度要求
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