Probe Station
CSA-8 semi-automatic alignment probe station

Automatic alignment test on wafer, simple and fast operation, high resolution and MAP display function.

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CSA-8 automatic alignment probe station

Measuring type: 3 inch, 4 inch

Test silicon wafer unit size: 20—200 mil

Positioning accuracy: ≤ ± 0.01mm / 110mm

Automatic alignment accuracy: ± 0.01mm

Mistest rate: ≤ 1 ‰

Automatic registration time: ≤ 15 s

Test speed 45 mil 5.0 pcs / s

50 mil 4.6 pcs / s

87 mil 4.2 pcs / s

Step resolution: 0.001

Z direction travel: 0 ~ 5mm adjustable

Turning angle θ of the stage: ± 20o




     CSA-8 type automatic alignment probe station can
The automatic alignment test on the wafer is easy to operate.
Fast, high test accuracy, with MAP display function
can. It can be completed automatically after connecting with the tester
Test and function of electrical parameters of various transistor cores
Test.
8英寸半自动探针台

Operation method

CSA-8 type automatic alignment probe station
Provides a clear and intuitive touch screen operation page,
Automatic touch of the wafer can be completed by touch
Bit test.

机器软件的操作界面


In addition, a more concise party is provided.
Convenient keypad operation mode, the operator can
Personal preferences and habits choose any kind of operation.


功能小键盘

Machine function

With automatic scanning registration function, registration accuracy
High and fast, Windows7 interface, dynamic map
The figure shows the test process.

With circular test, range retest, edge detection
Test, range dot, recycling test, rectangle
Test and offline test multiple test functions.


 With X, Y, Z three-axis motion structure, soft operation
It can accurately compensate the verticality and flatness.
Prove the machine's control accuracy and work stability.

 With real-time RBI, offline RBI and lag
After RBI function. New type of marking device, in use
Time is up to 3 days, no ink is dripped, and 60% of operation time is saved.

 With Z-axis stroke segmented motion function, its
Divided into basic height, contact height, contact buffer,
Overshoot and foldback height with edge detection
Function to prevent probe-to-chip during test
Scratches and poor contact between the probe and the chip.

Test pin mark ratio picture (reflective white point is pin mark)

Multiple cores                         Single core

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